PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY APPLICATION
• Market segmentation by application
• Comparison by application
• Consumer electronics – Market size and forecast 2018-2023
• Satellite communication – Market size and forecast 2018-2023
• Electronic warfare equipment – Market size and forecast 2018-2023
• Others – Market size and forecast 2018-2023
• Market opportunity by application
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
• Trends
PART 11: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 12: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Infineon Technologies
• MACOM
• NXP Semiconductors
• Skyworks Solutions
• TOSHIBA
PART 13: APPENDIX
• Research methodology
• List of abbreviations
Exhibit 01: Global semiconductor market
Exhibit 02: Segments of global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2018
Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 09: Five forces analysis 2018
Exhibit 10: Five forces analysis 2023
Exhibit 11: Bargaining power of buyers
Exhibit 12: Bargaining power of suppliers
Exhibit 13: Threat of new entrants
Exhibit 14: Threat of substitutes
Exhibit 15: Threat of rivalry
Exhibit 16: Market condition – Five forces 2018
Exhibit 17: Application – Market share 2018-2023 (%)
Exhibit 18: Comparison by application
Exhibit 19: Consumer electronics – Market size and forecast 2018-2023 ($ millions)
Exhibit 20: Consumer electronics – Year-over-year growth 2019-2023 (%)
Exhibit 21: Satellite communication – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Satellite communication – Year-over-year growth 2019-2023 (%)
Exhibit 23: Electronic warfare equipment – Market size and forecast 2018-2023 ($ millions)
Exhibit 24: Electronic warfare equipment – Year-over-year growth 2019-2023 (%)
Exhibit 25: Others – Market size and forecast 2018-2023 ($ millions)
Exhibit 26: Market opportunity by application
Exhibit 27: Customer landscape
Exhibit 28: Market share by geography 2018-2023 (%)
Exhibit 29: Geographic comparison
Exhibit 30: Comparison_5
Exhibit 31: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 32: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 33: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 34: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 35: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 36: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 37: Key leading countries
Exhibit 38: Country_Legend_16
Exhibit 39: Market opportunity
Exhibit 40: Decision framework
Exhibit 41: Impact of drivers and challenges
Exhibit 42: Vendor landscape
Exhibit 43: Landscape disruption
Exhibit 44: Vendors covered
Exhibit 45: Vendor_analysis1
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Infineon Technologies – Vendor overview
Exhibit 49: Infineon Technologies – Business segments
Exhibit 50: Infineon Technologies – Organizational developments
Exhibit 51: Infineon Technologies – Geographic focus
Exhibit 52: Infineon Technologies – Segment focus
Exhibit 53: Infineon Technologies – Key offerings
Exhibit 54: MACOM – Vendor overview
Exhibit 55: MACOM – Business segments
Exhibit 56: MACOM – Organizational developments
Exhibit 57: MACOM – Geographic focus
Exhibit 58: MACOM – Segment focus
Exhibit 59: MACOM – Key offerings
Exhibit 60: NXP Semiconductors – Vendor overview
Exhibit 61: NXP Semiconductors – Business segments
Exhibit 62: NXP Semiconductors – Organizational developments
Exhibit 63: NXP Semiconductors – Geographic focus
Exhibit 64: NXP Semiconductors – Segment focus
Exhibit 65: NXP Semiconductors – Key offerings
Exhibit 66: Skyworks Solutions – Vendor overview
Exhibit 67: Skyworks Solutions – Organizational developments
Exhibit 68: Skyworks Solutions – Geographic focus
Exhibit 69: Skyworks Solutions – Key offerings
Exhibit 70: TOSHIBA – Vendor overview
Exhibit 71: TOSHIBA – Business segments
Exhibit 72: TOSHIBA – Organizational developments
Exhibit 73: TOSHIBA – Geographic focus
Exhibit 74: TOSHIBA – Segment focus
Exhibit 75: TOSHIBA – Key offerings
Exhibit 76: Research framework
Exhibit 77: Validation techniques employed for market sizing
Exhibit 78: Information sources
Exhibit 79: List of abbreviations
【掲載企業】
Infineon Technologies、MACOM、NXP Semiconductors、Skyworks Solutions、TOSHIBA